Cena | €25.38 |
- Size: Liquid, 1 L
Directions
Unscrew cap from dispensing end and screw on dispensing needle. Remove end cap from plunger and insert plunger or attach to an automatic dispenser. The supplied plunger will be slightly loose to prevent draw back when removing.
Storage and Handling
Store refrigerated between 2-10°C [35-50°F] to minimize solvent evaporation, flux separation, and chemical activity. Storage of syringes is preferred in an upright position with tip down to prevent flux separation and air entrapment. Use at room temperature, warm up can be achieved by removing from refrigerator 3 hours before use, faster warm up can also be achieved by placing in a sealed container in a water bath at near ambient temperature for 30 minutes.
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of between 68-77°F (20-25 °C) at a relative humidity of 40-65% will ensure consistent performance and maximum life of paste.
Pressure
The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept in the range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure (more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging may be expected. The external air pressure supply should be maintained constant.
Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a dispensing application depends on viscosity, which can be altered by temperature change. If solder paste is purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.
Cleaning
MG 4860P is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
Reusing Solder Paste
This is not normally recommended, because it typically generates more problems than it is worth. If you do decide to reuse solder paste, these pointers may be helpful. This paste should be tightly sealed and refrigerated. Then, the paste may be reused at a later date, provided that the paste has not separated or thickened significantly compared to its original properties. Storage of syringes is preferred in an upright position with tip down to prevent flux separation and air entrapment.
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of between 68-77°F (20-25 °C) at a relative humidity of 40-65% will ensure consistent performance and maximum life of paste.
Cleaning Misprint Boards
If you should have a misprinted board, the paste may be cleaned off manually with MG 8241 Alcohol Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent any paste from being deposited in unwanted areas of the board. Without stencil cleaning, solder balling will increase. We recommend a periodic dry wipe (every 5 to 10 boards) with an occasional MG 8241-T or 8241-W Alcohol Wipe (every 15 to 25 boards). When running fine pitch boards, the cleaning may need to become more frequent.
Disposal
MG 4860P should be stored in a sealed container and disposed of in accordance with state & local authority requirements.
Physical Properties | Value |
---|---|
Color | Clear |
Appearance | Colorless |
Specific Gravity @25°C | 0.841 ±0.03 |
Water solubility | Immiscible |
Refractive Index | 1.472–1.474 |
Optical Rotation @25 °C | +96° to +104° |
Flash Point, Closed Cup | >43 °C [>110 °F] |
Percent d-Limonene | 95–98.5% |